Display, led chip therefor, pixel therefor, controlling method therefor, computer program therefor

ABSTRACT

A display (100) comprising a plurality of LED chips (604), each LED chip (604) comprising a plurality of light emitting elements (606a-c). Each LED chip (604) is arranged such that a first light emitting element (606a) is configured to illuminate a sub-pixel, and a second light emitting element (606b) is configured to illuminate a sub-pixel using substantially the same wavelength of light as the first light emitting element. There is also described an LED chip, a display pixel, a controlling method, a computer device and a computer program for a display.

TECHNICAL FIELD

The invention relates to the field of displays.

BACKGROUND

ILED (Inorganic Light Emitting Diode) displays provide an alternative tothe better known LCD (Liquid Crystal Display) and the OLED (OrganicLight Emitting Diode) displays. An ILED display does not have any of thenegative qualities of LCD or OLED displays as its display sub-pixels arebased on ILED light sources and has all the advantages of this class ofdevice. This results in a display that has the better performancecharacteristics of an OLED type direct view display as well as therobustness, long-life and stability that is inherent to ILED technology.

Display pixel failure and need for repair presents additional complexityto the display manufacturing process. The number of acceptablemalfunctioning pixels in a display is covered by ISO-13460-2. Mostdisplay manufacturers supply class 2 displays which allow no more thantwo malfunctioning pixels (always on or always off) per million pixels.This requires a display sub-pixel yield of 99.998%.

For a 1920×1080 display (FHD displays), which are becoming increasinglycommon in mobile phones, there are 2,073,600 display pixels. Therefore,in an ILED type display, 6,220,800 individual ILED chips must bepackaged (an R, G and B for each display pixel). As each device musthave both p and n contacts this results in 12,144,600 contacts that mustbe made. As per the ISO-13460-2 standard only 4 display sub-pixels maybe malfunctioning. Therefore the required yield for LED devices andinterconnection is 99.99996%. Achieving this target is a significantchallenge in the development of ILED type displays.

To increase the yield of displays, redundancy for chips/interconnectionfailure is used. In standard designs, this is done by placing two ILEDchips at each display sub-pixel. Using this solution a total 12,144,600individual ILED devices must be fabricated and “pick-and-placed” duringassembly of the display. Subsequently, or as part of the pick-and-placeprocess, interconnection must be made to 24,289,200 contacts. Thisapproach can successfully reduce the issue of device failure as thelikelihood of two failed devices/interconnections in the same displaysub-pixel is smaller than the risk with a single device/interconnection.However, there are implications for the cost and complexity of thesystem. In addition, the presence of multiple structures (i.e. otherchips) in close proximity to an emitting ILED may results in unwantedreflections and other optical interference which affect the performanceof the display. An example of this is the contrast-reducing lightreflection that may be produced at the surface of the ILED chips.

SUMMARY

An ILED design is described that removes the need for two individualILEDs chips at each display sub-pixel, whilst maintaining redundancymeasures and reduces the number of connections required. This results inenhanced manufacturability of this class of display as well as openingthe potential for new drive schemes which may simplify the associatedelectronics.

According to a first aspect, there is provided a display comprising:

-   -   a plurality of LED chips, each LED chip comprising a plurality        of light emitting elements;    -   wherein each LED chip is arranged such that a first light        emitting element is configured to illuminate a sub-pixel, and a        second light emitting element is configured to illuminate a        sub-pixel using substantially the same wavelength of light as        the first light emitting element.

As an option, the first and second light emitting elements are selectedfrom any of an inorganic LED and an organic LED.

Optionally, the first light emitting element is configured to illuminatea sub-pixel of a first display pixel and the second light emittingelement is configured to illuminate a sub-pixel of a second displaypixel.

Each LED chip optionally comprises a plurality of Addressable ArrayElements, each Addressable Array Element providing a light emittingelement.

As an option, each ILED chip is integrated with a substrate, thesubstrate configured to provide control and power to each ILED chip.

The substrate optionally comprises any of an active matrix control and apassive matrix control.

The display optionally further comprising an optical film disposed overthe plurality of LED chips, the optical film configured to direct lightfrom each light emitting element.

As an option, each LED chip has a geometric shape such that each lightemitting element is located substantially at a corner of the LED chip.As a further option, each LED chip is substantially triangular, having alight emitting element located towards each corner, and each displaypixel is substantially hexagonal, each LED chip being located at anintersection of three adjacent display pixels thereby forming asub-pixel in each of the three adjacent display pixels.

As an option, a display pixel comprises a first sub-pixel provided by afirst light emitting element from a first LED chip and a secondsub-pixel provided by a second light emitting element from a second LEDchip, and the first and second light emitting elements share a commoncathode.

Each LED chip optionally comprises a phosphor such that, in use, eachLED chip can emit light at more than one wavelength.

According to a second aspect, there is provided an LED chip configuredfor use in a display, the LED chip comprising a first and a second lightemitting element arranged to illuminate a sub-pixel, each light emittingelement arranged to emit light at substantially the same wavelength.

As an option, each light emitting element is located on the ILED chipsuch that it forms a sub-pixel for a display pixel, and no two lightemitting elements forms sub-pixels for the same display pixel.

The LED chip optionally comprises a plurality of Addressable ArrayElements, each Addressable Array Element providing a light emittingelement.

The LED chip is optionally integrated with a substrate, the substrateconfigured to provide control and power to the LED chip.

As an option, the LED chip is substantially triangular, having a lightemitting element located towards each corner, such that the LED chip islocatable at an intersection of three adjacent hexagonal display pixelsthereby providing a sub-pixel in each of the three adjacent displaypixels.

According to a third aspect, there is provided a display pixel for adisplay, the display pixel comprising:

-   -   a plurality of light emitting elements located in the display        pixel, each light emitting element provided by a different ILED        chip.

According to a fourth aspect, there is provided a method of controllinga display, the method comprising controlling power to a plurality oflight emitting elements located in a display pixel of the display, eachlight emitting element in the display pixel provided by a different ILEDchip.

According to a fifth aspect, there is provided a computer devicecomprising:

-   -   an output connecting the computer device to the display and        configured to control power to a plurality of light emitting        elements located in a display pixel of the display, wherein        either each light emitting element in the display pixel provided        by a different ILED chip or a single chip for a display pixel        comprises at least two light emitting elements configured to        emit light at substantially the same wavelength; and    -   a processor configured to control the display.

According to a sixth aspect, there is provided a computer programcomprising computer readable code which, when run on a computer device,causes the computer device to control power to a plurality of lightemitting elements located in a display pixel of a display, each lightemitting element in the display pixel provided by a different ILED chip.

According to a seventh aspect, there is provided a computer programproduct comprising a computer readable medium and a computer programaccording to claim 20, wherein the computer program is stored on thecomputer readable medium.

The computer readable medium is optionally a non-transitory computerreadable medium.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates schematically a plan view of an exemplary ILEDlayout;

FIG. 2 illustrates schematically distinctions between LED chip types asdescribed herein;

FIG. 3 illustrates schematically exemplary components of a display;

FIG. 4 illustrates schematically a plan view of an exemplary ILED layouthaving sub-pixel redundancy;

FIG. 5 illustrates schematically a plan view of an exemplary ILED layoutwith two corresponding Addressable Array Elements from Addressable ArrayChips for each display pixel;

FIG. 6 illustrates schematically a plan view of an exemplary displayhaving addressable LED arrays for illumination of multiple display subpixels;

FIG. 7 illustrates schematically a close view of addressable arraydevices used to illuminate multiple display pixels;

FIG. 8 illustrates schematically a plan view of an “array in centre”layout; and

FIG. 9 illustrates schematically in a block diagram an exemplarycomputer device.

DETAILED DESCRIPTION

The following abbreviations are used in this description:

-   Light Emitting Diode (LED) A semiconductor device which produces    light when the appropriate electrical bias is provided. It is noted    that a micro-LED (μLED) may be considered a type of LED.-   Emitter Any light emitting source, generally an LED. It is noted    that a μLED emitter may be an emitter and may comprise only a part    of a μLED device.-   LED chip A piece of semiconductor material that can generate light    and has been singulated from a semiconductor wafer on which it has    been fabricated.-   Single Emitter Chip (SEC) An LED chips with only one emitting region    (or emitter). Generally the whole chip will illuminate, although    this may not be the case in respect of μLEDs.-   Addressable Array Chip (AAC) An LED chip which has more than one    distinct light generating region (or emitter) that can be    independently addressed.

Addressable Array Element (AAE) An independently addressable emittingarea (or emitter) in an Addressable Array Chip.

-   Non-addressable Array Element (NAC) An LED chip which has more than    one distinct light generating region (or emitter) which cannot be    independently addressed. (NAC)-   Display Pixel: A component of a display that is used to build the    total image. It generally consists of R, G and B sub-pixels which    can be independently controlled to produce a range of colours.

Display Sub-Pixel: A sub-section of the Display Pixel which typicallycomprises a single colour (generally R, G or B).

Exemplary displays comprise the arrangement of R, G and B display subpixels to form a single display pixel. A typical configuration for anILED display 100 is highlighted in FIG. 1, where each pixel 102comprises R, G and B chips 104 a-c packed together to provide thenecessary light for each pixel 102 of the display 100. In this example,each R, G and B chip 104 a-c has one emitting area per chip or, moregenerally, the whole active area of the chip illuminates. These aretermed Single Emitter Chips (SECs). The typical/minimum size of these R,G, B chips 104 a-c is 20 μm×20 μm although there are examples wheresmaller devices are used. For larger displays with moderate resolutionthe one to one relationship between SEC and display sub-pixel results inthe requirement for a very large number of ILED chips. The inventorshave appreciated that this raises significant manufacturability and costchallenges. For ultra-high resolution or very small displays, the sizeof the SECs may limit the area and size of the display sub-pixels andthus the overall display resolution.

FIG. 2 illustrates schematically a relationship between various ILEDchip types. From FIG. 2, it can be seen that an LED chip 200 may have atleast three different types: an addressable array chip 202, whichcomprises a plurality of addressable array elements (or emitters) 204; anon-addressable array chip 206, which comprises a plurality of arrayelements (or emitters) 208 that cannot be addressed individually; and aSEC 210.

Redundancy in ILED based displays reduces the risk of failed ILEDdevices or interconnections, which may result in failed display pixelsor sub-pixels. Adding extra ILED chips at each display sub-pixel, asshown in FIG. 4, will result in double the wafer area, double thepick-and-place steps, double the electronic drivers and double theinterconnections. FIG. 4 shows a display with redundancy for eachsub-pixel. Other exemplary displays disclosed herein use arrays ofAddressable Array Elements to reduce the above requirements. Each ILEDAddressable Array Chip may contain more than one independentlyaddressable light source. This allows for the ILED to illuminatemultiple display sub-pixels from a single chip or to have a secondelement on the same chip in each display sub-pixel which illuminates ifthere is a failure in the first element.

FIG. 5 illustrates an exemplary display 500 that allows for more thanthe minimum number of Emitters in each display pixel 502—i.e. itprovides additional Emitters in each pixel/sub pixel. The use of arraysmean that, while there are more available emitters, there is a reductionin the number of chips (and hence pick-and-place steps) when compared toother redundancy processes.

Exemplary displays disclosed herein are, therefore, a low cost and lesscomplex route to including redundancy in an ILED display.

Exemplary methods and apparatus disclosed present displays comprisingILED chips and methods for their assembly, such that redundancy againstILED chip failure is included in the system without a significantincrease in manufacturing complexity.

A display consists of a large array of individual display componentsthat can be selectively illuminated. These components are referred to asDisplay Pixels. In a multi-colour display the smaller components relatedto the different colours are called Display sub-pixels. A display pixelcomprises a plurality of display sub-pixels. In general the differentcolours used for sub-pixels are red, green and blue (R, G, and B).

Typically, for an LCD display, the display sub-pixels are created bycolour filters and a liquid crystal optical element to selectively allowthe transmission of light from a white backlight based on the pixelstate. In typical ILED displays, a large array of individuallyaddressable R, G and B ILEDs are selectively illuminated based on thepixel state to generate pixels of various colours using the intensity oflight from each sub-pixel. In typical ILED display designs, SingleEmitter Chips (SECs) are used. No colour filter or liquid crystal isrequired. As the size or resolution of a display is increased the totalnumber of ILED chips required increases.

In the current invention, an array of Addressable Array Elements (AAEs)is fabricated on Addressable Array Chips (AACs). FIG. 2 illustrates therelationship between AAEs and AACs. These array chips reduce the numberof chips that must be placed and the number of interconnectionsrequired.

In exemplary displays, the AACs are placed at an interface between twoadjacent display pixels. The AACs can then be used to selectivelyilluminate a sub-pixel in each of the adjacent display pixels (formingthe display sub-pixels of the display). As each AAC contains more thanone Element (or emitter), each ILED chip can be used to illuminate morethan one display sub-pixel and, hence, a number of importantconsiderations in the manufacturing of these displays are simplified.

An example of such a layout is provided in FIG. 6, which shows a display600 comprising a plurality of pixels 602. A plurality of ILED chips 604,each comprising a plurality of individually addressable emitters 606 a-care arranged at the interface between adjacent display pixels 602, suchthat each emitter 606 a-c is in a different display pixel 602. The ILEDchips 604 comprise red, green or blue emitters (typically, all the samecolour on a single ILED chip 604) and they are arranged at the interface(or border) between adjacent display pixels 602 such that each displaypixel comprises at least one emitter 604 a-c of each colour.

In the exemplary display 600, the ILED chips 604 comprise three emitters606 a-c of a single colour and the display pixels 602 have a hexagonalshape. Therefore, the ILED chips 604 can be arranged such that twoemitters (from different ILED chips) of each colour are in each displaypixel 602, as shown in FIG. 6. As such, each sub-pixel of a displaypixel 602 comprises two emitters 606 a-c that are each from a differentILED chip 604.

Exemplary displays may contain one or more of the following:

-   -   ILED chips of a single colour;    -   Each ILED chip contains a plurality of Elements (i.e. each ILED        formed by an array of N×M elements (or emitters) also known as        an Addressable Array Chip);    -   The light from individual elements (or emitters) in an AAC can        be used to illuminate one or more display sub-pixels; and    -   A substrate, which enables electronic driving and control of the        ILED chips or which has contacts to an electronic driver.

The ILED chips are designed as Addressable Array Chips (AACs) with morethan one individually Addressable Array Elements (AAEs). The location ofthe elements on the AACs is dependent on the target illumination area onthe display.

In the current invention ILED chips are designed and packaged to reducethe total number of LED chips required.

Shown in FIG. 1 is a top down view of a basic ILED display 100. Withineach display pixel 102 are individual ILED chips 104 a-c, in this case 3single R, G and Blue ILED chips each containing a single emitter—i.e.the chips are Single Emitter Chips (SECs). These ILED chips 104a-c formthe display sub-pixels of the display pixel 102 and each chip isindividually addressable. It should be noted that for simplicity only asingle light source/LED is shown for each display sub-pixel (i.e. thereis no redundancy in this figure).

Shown in FIG. 4 are four display pixels (in the same configuration asthat of FIG. 1) where redundancy for device failure has been includedbased on SECs. The addition of redundancy to the design in FIG. 1results in double the number of chips that must be fabricated andsuccessfully mounted/interconnected. Standard ILED-type displays use aSEC for each Display sub-pixel. In larger displays this requires a verylarge number of ILED chips, pick-and-place steps and interconnections.As outlined above, more than 12 million individual LED chips arerequired for a 1920×1080 display. To satisfy class 2 standards, onlyfour display sub-pixels can be defective. This results in a verysignificant challenge to the manufacture of such displays. In order toovercome yield issues, redundancy against device or connection failureis designed into the system. This generally is achieved by placing twoSECs for each display sub-pixel. While this may reduce the number ofrejected displays, it is a significant increase in the pick-and-placeprocess steps required, the amount of ILED material required and thecomplexity of the electronic drive system. It should be noted that forall ILED displays fabricated a parallel method of pick-and-place is usedto allow for and reduce the large number of placements. However, thisdoes not reduce the complexity of a high number of devices to be placedas, even in a parallel process, an increase number of devices will alsoincrease the probability of a device failure. This may be due to thefailure to pick a device, to release a device, a device being placed inan incorrect location or a failure to electrically connect to thedevice.

An example of a simple system without redundancy is shown in FIG. 1while a system with redundancy included is shown in FIG. 4.

In exemplary methods and apparatus disclosed herein, ILED chips compriseAddressable Array Chips (AAC) used to illuminate the display pixels. Inone exemplary apparatus, an AAC may contain two Addressable ArrayElements (AAE) (e.g. ILED emitters). The ILED emitters can beselectively illuminated, such that one or both of the ILED emitters canbe illuminated. In the case of the failure of an Element on the AAC, theother active Element on the device can be used. The approach of using anAAC will reduce by 50% the number of pick-and-place steps for theassembly of the displays. As the AAC may be fabricated with a commonground line between the two active elements, the current invention wouldrequire only three connections per display sub-pixel (two anodes and onecathode). In contrast the standard solution requires four connectionsper display sub-pixel, an increase of 33%, to connect the one anode andone cathode on each LED.

In another exemplary display, each AAC may comprise more than twoAddressable Array Elements (or emitters). These AACs can be subsequentlypositioned such that each element on an AAC illuminates a differentdisplay sub-pixel, each on an adjacent display pixel. In this design thenumber of pick-and-place steps and interconnections is greatly reducedwhile maintaining the redundancy of this system. An example of such asdesign is shown in FIG. 6. A closer look at the display pixels are shownin FIG. 7. In these figures, the boundaries of the display pixels areshown by the dotted hexagon shape.

Referring to FIG. 7, a display Pixel B 700 can be illuminated by a blueElement on Addressable Array Chip 1 702 or a blue Element on AddressableArray Chip 2 704. Therefore, redundancy for the blue display sub-pixelis provided by Addressable Array Chip 2 704 if the left most emitter onAddressable Array Chip 1 702 fails. Similarly for the red and greendisplay sub-pixels, redundancy is provided by emitters on otherAddressable Array Chips. It is noted that the number of chips requiredto provide redundancy in the above design is reduced compared to knownredundancy methods. For Display Pixel B a total of six Addressable ArrayChips are required. However, these Addressable Array Chips are sharingtheir Addressable Array Elements with other Display Pixels. EachAddressable Array Chip provides a third of its emitters to Display PixelB. Therefore it can be said that two Addressable Array Chips arerequired for each Display Pixel—in contrast to three in other designswith no redundancy (FIG. 1) or six in other designs with redundancy(FIG. 4).

Each of the Addressable Array Chips may also share a cathode connection.Therefore, the total number of connections is reduced. For each displaypixel there will be six anodes (one for each of the emitters/activeregions) and a third of six cathodes (which are shared) resulting ineight interconnections. In contrast other ILED displays with redundancyrequire twelve interconnections.

Note that the positioning of the Addressable Array Element in thedisplay sub-pixels will not be a significant issue. The relativeposition and pitch of the Addressable Array Elements is of greaterimportance than the actual location. Due to the high resolution ofcurrent generation displays, the distance between a failed AddressableArray Element and its replacement will be in the range from 30-200 μm.This displacement will not be significant especially when the failedpixels are randomly distributed across the screen. In addition when areplacement AAE must be used due to the failure of the “preferred” AAEthen other “replacement” AAEs may also be selected. The number of“replacement” pixels used could be decreased as distance increases fromthe malfunctioning pixel. Hence the effect of positional variationcaused by a failed Element would be gradual and not obvious to humanperception.

For the above layout there may exist a “preferred” Addressable ArrayElement that could be illuminated such that the pitch between displaysub-pixels is optimized for viewer experience. In the majority of casesthis preferred Element will be functioning and can be used. For example,in a 1920×1080 display there are 6,220,800 display sub-pixels. If 10 ofthese display sub-pixels were malfunctioning then, without redundancy,this display would be discarded. However, using the current inventionthese malfunctioning pixels could be corrected with only 0.00016% ofAddressable Array Elements in their non-optimum location. Note thatthese non-optimum Elements would, in all probability, be randomlydistributed around the display.

Another feature of an ILED display using Addressable Array Chips is theuse of optical films or elements to position the light appropriately.Such films have the ability to direct light with high efficiency. In thecurrent invention such films may be used to bring the light fromemitters at the edge of a display pixel to its centre. This would allowfor the optimization of the spatial distribution of the light within thedisplay pixel. In effect, this optical film would position the lightfrom the “replacement” Element such that it was close to the position ofthe “preferred” Element or the appropriate position in the displaysub-pixel.

An alternative method of producing three colour display sub-pixels isthe conversion of a monochromatic light source into more than onecolour. This can be achieved using a number of materials includingtraditional phosphors (for example Yttrium aluminium garnet, Y₃Al₅O₁₂),quantum dots or colloid phosphors. For devices such as the LED with apixel diameter in the order of less than 50 μm, a quantum dot solutionwould provide adequate uniformity. For such a design, a blue ILEDAddressable Array Chip containing three Addressable Array Elements maybe fabricated in a single colour. Quantum dot materials, which convertto two wavelengths, would be placed in the path of the emitted light fortwo of these Elements. The effect of the quantum dots phosphors wouldresult in light at three wavelengths being produced by a single chip.This Addressable Array Chip could form the totality of the displaysub-pixel or two could be used to provide redundancy.

Shown in Table 1 is a comparison of the current invention and a standardILED display with redundancy in a number of the major factors associatedwith Display manufacturing. It is assume that each anode and cathodecontact requires 10 um². It is further assumed that both contacts are onthe same side of the device. While contacting to opposite sides of anILED chips is possible, it is problematic as it restricts the areaavailable for light extraction from the light source. An example of the“Array in Centre” design is shown in FIG. 8. FIG. 4 shows a standardILED design with redundancy and FIG. 6 shows the “Array at edges”design.

TABLE 1 Overview of various parameters for the fabrication of 1920 ×1080 ILED type display in standard design and using the design proposedin the current invention. Pick & Place Chip area Design placements (mm²)Interconnections Standard 12,441,600  248.0 24,883,200 Array in centre6,220,800 186.6 18,662,400 Array at edges 4,147,200 165.9 16,588,800

In one exemplary display, the ILED Addressable Array Chips are towardsthe centre of the display pixel as shown in FIG. 8. In another exemplarydisplay, the ILED Addressable Array Chips are towards the edge of thedisplay pixel and the emitters of an AAC may illuminate more than onedisplay pixel. In another exemplary display, the light from the ILEDAddressable Array Chips is coupled to an optical film which positionsthe light appropriately before it emerges from the display.

In another exemplary display, ILED Addressable Array Chips with quantumdot phosphors would be used to produce multiple wavelengths from asingle chip.

FIG. 9 illustrates schematically in a block diagram an exemplarycomputer device 900. The computer device is connected to a display 902that comprises display pixels, for example, as shown in FIGS. 5 to 8. Aprocessor 904 controls the display and selectively provides power to theILED Addressable Array Chips of the display. A non-transitory computerreadable medium in the form of a memory 906 is provided, which is usedfor storing a program 908 which, when executed by the processor 904,causes the processor to behave as described above. Note that the programmay be provided from an external computer readable medium 910, such as aCD, a flash drive, a carrier wave and so on.

Whilst specific embodiments of the invention are described above, itwill be appreciated that a number of modifications and alterations maybe made thereto without departing from the scope of the invention asdefined in the appended claims.

Numbered Clauses

1. An ILED type display such that there is more than 1 Addressable ArrayElements for each display sub-pixel and therefore provides redundancyagainst device failure and contains:

a. A plurality of ILED chips

b. Each ILED chip contains a plurality of Addressable Array Elements(i.e. each ILED chip is an Addressable Array Chip).

c. The light from individual Addressable Array Elements in anAddressable Array Chip can be used to illuminate one or more displaysub-pixels.

2. As per clause 1, where the Addressable Array Chips are integratedwith a substrate which enables electronic driving and control of theILED chips or which has contacts to an electronic driver.

3. As per clause 1, where an optical film is used to position the lightfrom a plurality of Addressable Array Elements to the appropriatepositions within the display pixel.

4. As per clause 1, where the ILED Addressable Array Elements Chips areat multiple wavelength for example red, green and blue.

5. As per clause 1, the ILED Addressable Array Chips are in geometricshapes with the emitters primarily at the corners.

6. As per clause 1, a display layout whereby an ILED Addressable ArrayChips is placed towards the centre of a display sub-pixel and theplurality of Addressable Array Elements can be selectively illuminatedsuch that redundancy against device failure is provided.

7. An ILED display layout whereby an ILED Addressable Array Chips isplaced towards the edge of multiple display pixels such that theplurality of Addressable Array Elements may illuminate more than 1display sub-pixel and as such, provide redundancy.

8. An ILED display such that the Elements providing redundancy share acommon cathode on the Addressable Array Chip.

9. As per clause 2, where the control substrate is an active matrix.

10. As per clause 2, where the control substrate is a passive matrix.

11. As per clause 1, where phosphors are integrated with the ILEDAddressable Array Chips such that more than one wavelength is produce byeach chip.

12. An optical film which is integrated with an ILED array such that thelight is controlled before it emerges from the display sub-pixel.

1-22. (canceled)
 23. A display comprising: a first light emitting diode(LED) chip including a plurality of first light emitting elements; and asecond LED chip including a plurality of second light emitting elements,the first and second light emitting elements configured to emit lighthaving the same wavelength; and a display pixel of the display includinga first light emitting from the first LED chip and a second lightemitting element from the second LED chip.
 24. The display of claim 23,wherein the first LED chip includes a singulated piece of semiconductormaterial.
 25. The display of claim 23, wherein the first LED and secondLED chip include the same type of semiconductor material.
 26. Thedisplay of claim 23, wherein the first LED chip comprises a plurality ofAddressable Array Elements, each Addressable Array Element providing afirst light emitting element of the plurality of first light emittingelements.
 27. The display of claim 23, wherein the first LED chip isintegrated with a substrate, the substrate configured to provide controland power to the first LED chip.
 28. The display of claim 27, whereinthe substrate includes an active matrix.
 29. The display of claim 27,wherein the substrate includes a passive matrix.
 30. The display ofclaim 23, further comprising an optical film disposed over the first LEDchip, the optical film configured to direct light from the plurality offirst light emitting elements.
 31. The display of claim 30, wherein theoptical film is configured to direct the light to a center of thedisplay pixel.
 32. The display of claim 23, wherein the plurality offirst light emitting elements are each located at a corner of the firstLED chip.
 33. The display of claim 23, wherein: the first LED chip istriangular and a first light emitting element of the plurality of firstlight emitting elements is located at each corner; and the display pixelis hexagonal.
 34. The display of claim 23, wherein the first LED chip islocated at an intersection of three adjacent display pixels.
 35. Thedisplay of claim 23, wherein the plurality of first light emittingelements of the first LED chip share a common cathode.
 36. The displayof claim 23, wherein the first LED chip is located at a center of thedisplay pixel.
 37. The display of claim 23, wherein the first LED chipis located at a corner of the display pixel.
 38. The display of claim23, further comprising a third LED chip including plurality of thirdlight emitting elements configured to emit light having a differentwavelength from the plurality of first light emitting elements of thefirst LED chip and the plurality of second light emitting elements ofthe second LED chip, the display pixel including a third light emittingelement from the third LED chip.
 39. The display of claim 23, furthercomprising a processor configured to provide power to one of the firstor second light emitting elements.
 40. The display of claim 39, whereinthe processor is configured to provide power to the first light emittingelement responsive to a failure in the second light emitting element.41. The display of claim 23, further comprising a third LED chipincluding a third light emitting element having quantum dot phosphors.42. The display of claim 23, wherein the first and second LED chips aresingulated pieces of semiconductor material placed on a substrate of thedisplay, the substrate configured to provide control and power to thefirst and second LED chips.